Samsung Electronics has seen its 12-inch wafer fab capacity utilization rise to 90% in the second quarter from 80% registered a quarter earlier, driven by stable 5/4nm process performance and the ...

TSMC is undertaking significant upgrades at its existing 8-inch and 12-inch fabrication facilities that process chips at 90nm and above, while accelerating expansion for cutting-edge 2nm and below ...

Plasma chemistry and etching processes form the backbone of modern semiconductor fabrication, enabling the precise patterning and removal of material layers essential to device performance. By ...

Plasma etching is perhaps the most essential process in semiconductor manufacturing, and possibly the most complex of all fab operations next to photolithography. Nearly half of all fab steps rely on ...

The semiconductor industry is developing the next wave of applications for atomic layer etch (ALE), hoping to get a foothold in some new and emerging markets. ALE, a next-generation etch technology ...