A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications ...

As design and manufacturing issues with true 3D design continue to be worked out, interim 2.5D technologies are moving ahead as engineering teams leverage this packaging-driven approach to manage heat ...

Amid the COVID-19 crisis, the global 3D IC and 2.5D IC Packaging Market estimated at USD 86.8 Billion in the year 2020, is projected to reach a revised size of USD 730 Billion by 2027, growing at a ...

DEAR BONNIE: I have been hearing about moving into a 5D world of consciousness, and I am not sure exactly what that entails, but I am noticing a difference in my attitude about what is acceptable and ...

James Cameron wants everyone to adopt 5D, a term coined by the film and television industry to describe shooting 2D and 3D simultaneously. We caught up with him at NAB recently and asked him why?