Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...
PITTSBURGH, Oct. 2, 2024 /PRNewswire/ -- Faraday Technology Corporation, a leading company in the semiconductor industry, is expanding its use of Ansys (NASDAQ: ANSS) technology to enhance its ...
Ansys ANSS is leveraging NVIDIA Corporation’s NVDA Omniverse application programming interfaces (APIs). This will “supercharge” the design of 3D integrated circuits (3D-ICs) through the integration of ...
Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for ...
PITTSBURGH, Sept. 26, 2013 /PRNewswire/ -- ANSYS subsidiary Apache Design announced today that its RedHawk(TM) and Totem(TM) products have completed methodology innovations to be included in TSMC's ...
Ansys has announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of ...
PITTSBURGH, Feb. 25, 2020 /PRNewswire/ -- With the release of Ansys ® RaptorH™, Ansys (NASDAQ: ANSS) will empower engineers to accelerate and improve 5G, three-dimensional integrated circuit (3D-IC) ...
Faraday Technology Corporation will use Ansys RaptorX™ on-chip electromagnetic (EM) modeling solution to enhance the development of advanced packaging designs for 2.5D/3D integrated circuits (ICs) ...
PITTSBURGH, April 23, 2025 /PRNewswire/ -- Through continued collaboration with TSMC, Ansys (NASDAQ: ANSS) today announced enhanced AI-assisted workflows for radio frequency (RF) design migration and ...
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