U.S. semiconductor companies were among the first to respond by disaggregating large chips into smaller, specialized chiplets ...

Chiplet Summit announces its fourth annual conference on February 17-19, 2026, at the Santa Clara Convention Center. The 2026 event will highlight the next wave of innovation in chiplet-based design ...

Chiplet Summit, the biggest chiplet show ever, announces its pre-conference day schedule. It will occur on Tuesday, February 17, at the Santa Clara Convention Center, ahead of the main event taking ...

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...

Breakthrough yield and device performance at high volume show team can scale company’s large-format advanced packaging for customers’ cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...

The International Test Conference is the electronic industry’s premier event dedicated to the testing of devices, boards, and systems, from design verification to final testing. At this year’s version ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

Researchers at Shanghai University have developed a physics-constrained, data-efficient artificial intelligence framework that enables accurate thermal field inversion in chiplet-based packaging ...

A new technical paper titled “Advanced Chiplet Placement and Routing Optimization considering Signal Integrity” was published by researchers at KAIST. “This article addresses the critical challenges ...