The artificial intelligence (AI) revolution has expanded rapidly since 2023, powering applications from chatbots to ...

Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...

GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center in Malta. G lobalFoundries (GF) plans to create a new center for advanced packaging ...

Burlingame, CA, Aug. 20, 2025 (GLOBE NEWSWIRE) -- Advanced Chip Packaging Market to Reach USD 50.38 Billion in 2025 as Demand for High-Performance and Miniaturized Devices Rises The Global Advanced ...

Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for ...

Lam Research Corporation LRCX sees advanced packaging as a major growth driver for its Systems segment sales in fiscal 2026. The company crossed $1 billion in advanced packaging-related revenues in ...

South Korean TC bonder (TCB) manufacturer Hanwha Semitech recently announced an organizational restructuring aimed at strengthening its development capabilities for next-generation... Despite flat ...

Just as the new plant located in Nanke Chiayi Park in Taiwan is expanding production, the downstream supply chain broke news that TSMC is eyeing off going to Pingtung to build a new CoWoS advanced ...

In spite of the initial reasons for this technology, it is now viewed as the best way to handle large amounts of data at blazing speeds. The hottest chip markets today—automotive AI for autonomous and ...

MILPITAS, Calif., Sept. 21, 2020 /PRNewswire/ -- Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the Kronos™ 1190 wafer-level packaging inspection system, the ICOS™ F160XP die sorting ...

One-on-one with Amkor’s R&D chief about why and where 2.5D and fan-outs are gaining traction, and what’s coming next. Semiconductor Engineering sat down to discuss advanced IC-packaging, the OSAT ...