Broadcom has introduced its 3.5D eXtreme Dimension System in Package (3.5D XDSiP) platform for ultra-high-performance processors for AI and HPC workloads ... of 3D-stacked logic, network and ...

Deutsche Telekom’s AI phone will launch in Germany in H2 2025, with plans for other European markets to follow. The mobile phone industry is witnessing a resurgence of ultra-slim devices ...

We also spent a considerable amount of time at TECNO’s booth (6B11, Hall 6) based on the “Create the AI Future” theme ... The SPARK Slim showed off an ultra-slim profile in a beautiful ...