A number of years ago, the packages of electronic systems were only intended to protect the circuit from mechanical stresses and to realize a simple fan-out from the close spacing of connections on ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

Design-for-assembly (DFA) and design-for-manufacture (DFM) techniques can be applied to products assembled manually or automatically or manufactured by specific techniques, such as machining, die ...

Lean manufacturing seeks to make clear what adds value by reducing everything else. Lean is clearly not a fixed-point objective; accelerating global market competition demands operational flexibility ...