Siemens and TSMC deliver new certifications and design solutions for the foundry’s most advanced process technologies.

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced delivery of a comprehensive design ...

A research team has achieved a significant breakthrough in clean energy technology. The team has successfully enhanced a ...

Many industry trends are driving chip developers to consider multi-die designs using advanced 2.5D and 3D technologies. Such designs enable incorporating heterogeneous and homogeneous dies in a single ...

In the era of EDA 4.0, artificial intelligence (AI) and machine learning (ML) are transforming what electronic design automation tools are capable of. For many of the challenges of physical IC design, ...

Day by day, technology continues to shrink while the transistor counts on chip increases, leading to greater design complexity. As a result, Metal ECO plays an important role in addressing last-minute ...

Our longstanding relationship with TSMC underscores the transformative power of collaborative innovation,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “By combining Siemens ...