TAIPEI (Taiwan News) — Ennostar and Germany’s Allos Semiconductors announced Monday a partnership to mass produce 8-inch ...

As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...

Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces the processing ...

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...

To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing systems.

AUSTIN, Texas — Ziptronix Inc., a spin-out from the Research Triangle Institute, said it has created a unique wafer bonding technique that enables three-dimensional chips. The approach can join logic ...

Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...