FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

HSINCHU, Taiwan--(BUSINESS WIRE)--Mycropore Corporation Ltd., a leading Taiwan-based supplier of micro-contamination control and filtration solution provider for advanced semiconductor industry, today ...

Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind ...

The global electroplating market size is projected to reach $27.2 billion by 2032, growing at a CAGR of 4% from 2023 to 2032 WILMINGTON, DE, UNITED STATES, June 25, 2025 /EINPresswire / -- Allied ...

VTT Technology Research Centre to use ClassOne Solstice S8 for advanced packaging This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer ...

In this paper, we describe a technique to prepare a copper layer on polyimide film using a polymer nanosheet as a nano-adhesion. We employ two kinds of functional polymer nanosheets: one works as an ...

The electroplating intermediate is a material used in the electroplating process to adjust characteristics such as grain size, gloss, thickness and plating speed. Most of them are configured as ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

- Automakers use the electroplating process extensively to prevent automobile parts from corrosion and restore worn chrome pieces, such as grills and bumpers, to their original condition - Electric ...

A highly transparent, flexible, stretchable and patternable copper fiber heater was successfully fabricated for potential use in smart windows and other applications. The thickness of the electrospun ...