New validation solutions enable data center operators to overcome bandwidth, latency, and interoperability challenges as AI ...

Keysight Technologies has introduced a set of validation solutions to help operators manage bandwidth limits, latency issues, ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performance Organic substrates reduce packaging costs and relax routing constraints in HBM designs Serialization shifts ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...

Samsung moves up its HBM4 production schedule and begins preparing for mass output of next generation high bandwidth memory chips. Nvidia chooses Samsung, not Micron Technology (NasdaqGS:MU), as a ...

Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen the company's ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...