Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

In this product-how to, ANSYS’ Steve Pytel explains how to use the ANSYS SIwave-DC simulation tool to predict DC power loss and voltage drop for a PCB. As supply voltages continue to decrease and ...

One of the big problems with doing PCB layout is finding a suitable footprint for the components you want to use. Most tools have some library although — of course — some are better than others. You ...