Keysight Introduces Scale-Up Validation Solutions for AI Data Centers

New validation solutions enable data center operators to overcome bandwidth, latency, and interoperability challenges as AI ...
Yahoo Finance

TER's Memory Test Sales Hit $128M: Is the Growth Thesis Strengthening?

Teradyne TER is benefiting from the growing demand for memory test solutions, particularly driven by advancements in AI applications and data center investments. In the third quarter of 2025, the ...
Electronic Design

HBM4 and SPHBM4: Scaling Memory Bandwidth for AI and HPC

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
Seeking Alpha

Teradyne Unveils Magnum 7H - The Next-Generation Memory Tester for High Bandwidth Memory Devices

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (TER) (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of the Magnum 7H, a ...
Embedded

High-bandwidth memory (HBM) options for demanding compute

Explosive growth of generative artificial intelligence (AI) applications in recent quarters has spurred demand for AI servers and skyrocketing demand for AI processors. Most of these processors — ...
Nasdaq

Advantest Unveils T5801 Ultra-High-Speed Memory Test System to Power Next-Generation DRAM Devices

TOKYO, Feb. 12, 2025 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced the T5801 Ultra-High-Speed DRAM Test System. The cutting-edge ...
NextBigFuture

NEO Semiconductor X-HBM Will Have 16X Bandwidth and 10X Memory Density

Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...