The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.
Silicon carbide (SiC) continues to carve out a place for itself in power electronics after decades of dominance by silicon. SiC-based power switches are becoming the gold standard in the three-phase ...
A new ultra-compact, stackable power module design drastically raises current delivery limits while shrinking footprint for ...
Microchip’s MCPF1525 power module is packaged for vertical power delivery. With datacenters taking what seems like the world’s electricity supply, anything engineers can do to reduce consumption helps ...
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