CN-1736 is a reworkable underfill designed for use with 0.4-mm-pitch package-on-package (POP) assemblies. With low viscosity, lower coefficient of thermal expansion (CTE) than previously, and greater ...
New York, Nov. 04, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Underfill Materials Industry" - https://www.reportlinker.com ...
The CN-1751-4 reworkable underfill encapsulant is crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies. It has a ...
YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, ...
NEW YORK, United States, June 12, 2023 (GLOBE NEWSWIRE) -- Zion Market Research has published a new research report titled “Molded Underfill Material Market 2023 – 2030” in its research database.
CN-1736 reworkable underfill encapsulant is designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. CN-1736 reworkable underfill encapsulant is designed to underfill 0.4-mm pitch ...
New York, Nov. 04, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Underfill Materials Industry" - https://www.reportlinker.com ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback