EDN

Pin-And-Socket Interconnect – exceptional strength and integrity

Autosplice has introduced an innovative “non-intrusive” pin-and-socket interconnect system with a patent-pending design that delivers exceptional strength and integrity while eliminating any need for ...
Semiconductor Engineering

Enhancing Test Socket Performance Through Application-Specific Validation And System-Level Per-Pin OQC

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
Semiconductor Engineering

Comparison Of State-Of-The-Art Models For Socket Pin Defect Detection

This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ, by Vijayakumar Thangamariappan, Nidhi Agrawal, Jason Kim, Constantinos Xanthopoulos, Ira Leventhal, and Ken Butler, ...
Electronic Design

Stamped spring pin socket for 0.8mm pitch Infineon’s LFBGA

Ironwood Electronics recently introduced a new socket addressing high performance requirements for burn-in and test applications—SBT-BGA-6553. The contactor is a stamped spring pin with 31 gram ...
EDN

BGA test socket features precise ball-to-pin alignment

Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...
TweakTown

AMD's next-gen AM6 socket expected to deliver 22% pin increase count, retain AM5 sizing

TL;DR: AMD's next-generation AM6 socket will support Zen 7 processors with 2100 pins, a 22% increase in pin density over AM5, while maintaining the same size. This enables higher power delivery ...