In 1999, Stig Oresjo, then of Agilent Technologies, conducted a major study of solder-joint defects on printed-circuit boards (PCBs). The study, which at the time provided the most definitive data on ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...

We might be amidst a chip shortage, but if you enjoy reverse-engineering, there’s never a shortage of intriguing old chips to dig into – and the 2513N 5×7 character ROM is one such chip. Amidst a long ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

New solar manufacturing facilities show higher rates of product defects, PV Tech has heard from Joerg Althaus of Clean Energy Associates. PV Tech spoke with Joerg Althaus of CEA about the ...

The complexities associated with the use of solders in electronic products. What’s the alternative to solder? A long-standing adage observes that “if the only tool in your tool chest is a hammer, the ...