Lapping is a final abrasive finishing operation that produces extreme dimensional accuracy, corrects minor imperfections of shape, refines surface finish and produces close fit between mating surfaces ...

The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...

During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...