The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

New research offers an enhanced understanding of common defects in transition-metal dichalcogenides (TMDs) -- a potential replacement for silicon in computer chips -- and lays the foundation for ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...