Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem like old technology, but it ...

A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside ...