System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...

Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...

The movement capability of humanoid robots starts at the joints. Harmonic joint modules are the core enabler of agile motion.

San Francisco, CA. Advantest at SEMICON West demonstrated that it is supporting both its T2000 and V93000 test platforms. For the latter, the company introduced the PVI8 floating power source, and for ...

Representing the most recent generation of double-data-rate (DDR) SDRAM memory, DDR4 and low-power LPDDR4 together provide improvements in speed, density, and power over DDR3. However, such speed and ...

With the proliferation of fiber-optic products containing interfaces ranging from Gigabit Ethernet to 10-Gbps SONET, the demand for optical testing capabilities is high. Unfortunately, so is the cost ...