Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Compression molded bulk carbon/epoxy molding compound costs significantly less than hand-layed sandwich construction because much of the latter’s touch labor is eliminated. The molding process enables ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Bringing mass reduction capabilities to mass production facilities, Dow Automotive can now offer 90-second cycle times for resin transfer molding (RTM) with Voraforce 5300 resin matrix, making ...