When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...

According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion in 2026 to USD 11.11 billion by 2034, ...

The motion control market is expanding from $16 billion in 2024 to a projected $23 billion by 2031, driven by AI-powered adaptive systems and smart conveyance technology that automatically optimize ...

The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...