LONDON--(BUSINESS WIRE)--Process Systems Enterprise (PSE), a Siemens business, today released its rebranded gPROMS Process advanced process modelling environment. Formerly known as gPROMS ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Fig. 1. Trade-off between fidelity/accuracy and simulation time for different solutions providing thermo-chemical analysis of composite parts during processing. Photo Credit: Convergent Manufacturing ...

For memory-intensive and high-performance computing, direct memory access (DMA) is indispensable. A typical DMA operation in PCI Express (PCIe) entails the transfer of data from the system memory to ...

The use of fiber-reinforced composites in Type 3, 4 and linerless Type 5 pressure vessels is growing, used to store compressed/renewable natural gas (CNG/RNG) and hydrogen as part of the global ...

This new software-in-the-loop system enables engineers to develop and validate ABB drive applications with microsecond EMT ...