Abstract: Majority investigations linking reliability to yield were focused on device/interconnect defects, but investigations at 2.5D/3D packaging level are quite limited. Herein, product yield and ...
Abstract: This paper introduces an approach to panel level package (PLP) molding to meet the demand for an effective large-format packaging technology. For PLP molding, compression molding is an ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback