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Hi, I'm Bill. I'm a software developer with a passion for making and electronics. I do a lot of things and here is where I document my learning in order to be able to inspire other people to make ...

Abstract: Traditional device packaging becomes a limiting factor in realizing the full performance potential of SiC. Thus, improved and advanced packaging technologies are required to bridge the gap ...

Abstract: This study aims to explore the solder fatigue lifetime of a developed high-voltage (1.7 kV/100 A) SiC power MOSFET module for on-board chargers (OBCs) subjected to power cycling test (PCT) ...