As artificial intelligence (AI) applications expand globally, United Microelectronics Corporation (UMC) is intensifying its efforts in advanced packaging and silicon photonics (SiPh) technologies. UMC ...

The report uses industry case studies to show where AI is improving packaging circularity and what barriers still limit progress. / Credit: IM Imagery via Shutterstock A new industry report from The ...

Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...

It’s a tough time in the charity sector. With the rises in cost of living and unemployment, fewer people are choosing – or able – to donate their money and/or their time to support charities. But ...

A new technical paper titled “Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review” was published by researchers at ...

We want to hear about it. By Callie Holtermann The college application process can be dizzying. High school students have long sought advice from family members and school counselors, Reddit forums ...

The challenge facing security leaders is monumental: Securing environments where failure is not an option. Reliance on traditional security postures, such as Endpoint Detection and Response (EDR) to ...

Ohio University’s Honors Tutorial College (HTC) is now accepting applications for two Faculty Fellow positions and for the Faculty Fellow for Wellness position. Applications for these positions are ...

Creative Commons (CC): This is a Creative Commons license. Attribution (BY): Credit must be given to the creator. The demand for sustainable alternatives to synthetic plastics increases, driving ...

Sept 30 (Reuters) - Using artificial intelligence for admissions essays is often discouraged or prohibited. For aspiring attorneys hoping to land a seat at two U.S. law schools next fall, it's an ...

Abstract: Electric and hybrid electric vehicles (EVs/HEVs) rely on power modules for efficient energy conversions. The market is demanding more compact power modules to achieve higher power density.