How hot is too hot to touch? - EDN
May 11, 2020 · Please also note that 120°F = 48.8888…°C or approximately 50°C. Advertisement. That doesn’t sound like a very high temperature, but I once tried an experiment on myself. I had this heat sink assembly that was becoming too hot to touch, so I decided to see just how hot it could get while I kept a finger on the heat sink surface ...
Equalization Techniques: CTLE, DFE, FFE, and Crosstalk - EDN
Oct 21, 2015 · DFE (decision feedback equalization) uses a decision circuit as part of its feedback loop. CTLE technology doesn’t change for PAM4 signaling. Tx FFE doesn’t change in principle, though with four different symbol levels, it changes in practice. But with four distinct “decisions” to feed back to the decision circuit, DFE differs for PAM4.
Eye Diagram Basics: Reading, Analyzing and Applying
Dec 16, 2011 · An eye diagram is a common indicator of the quality of signals in high-speed digital transmissions. An oscilloscope generates an eye diagram by overlaying sweeps of different segments of a long data stream driven by a master clock. The triggering edge may be positive or negative, but the displayed pulse that appears after a delay period may go ...
Clock Domain Crossing Techniques & Synchronizers - EDN
Sep 30, 2014 · In general, a conventional two flip-flop synchronizer (2-FF) is used for synchronizing a single bit level signal. As shown in Figure 1 and Figure 2 , flip flop A and B1 are operating in asynchronous clock domain. There is probability that while sampling the input B1-d by flip flop B1 in CLK_B clock domain, output B1-q may go into metastable state.
Gate level simulations: verification flow and challenges - EDN
Mar 5, 2014 · Simulations are an important part of the verification cycle in the process of hardware designing. It can be performed at varying degrees of physical abstraction: (a) Transistor level. (b) Gate level. (c) Register transfer level (RTL) Advertisement. In many companies RTL simulations is the basic requirement to signoff design cycle, but lately ...
Memory fault models and testing - EDN
Jun 29, 2015 · Read destructive Faults (RDFs): A read operation is performed to the cell causes inversion of the value in the cell and returns the incorrect value. There are two types of read destructive faults: 1) Memory cell in state 0, read 0 on it. Cell becomes 1. Denoted as. 2) Memory cell in state 1, read 1 on it.
HBM memory chips: The unsung hero of the AI revolution - EDN
Jan 31, 2024 · A Digitimes report claims that Nvidia has paid SK hynix and Micron advanced sums ranging from $540 million to $770 million to secure the supply of HBM memory chips for its GPU offerings. SK hynix plans to proceed with the mass production of the next version of these memory devices—HBM3E—while also carrying out the development of next ...
Parametric on-chip variation: A step towards accurate timing analysis
Aug 7, 2019 · To model these parameter variations, a few engineers came up with the on-chip variation (OCV) model. The concept of OCV was first introduced in technology nodes above 90nm. The fundamental idea behind OCV is to apply global derates on the whole design irrespective of the type of cells, its individual variation or its slew-load conditions.
EDN - Voice of the Engineer
Negative time-constant and PWM program a versatile ADC front end. A analog front-end that combines the functions of the INA, DPG, and S&H in a single topology controlled by the timing from a PWM logic Continue Reading... R Jayapal November 5, 2024 1. Design Design Ideas.
Design PCBs for EMI, part 2: Basic stack-up - EDN
Mar 20, 2019 · Design PCBs for EMI, part 2: Basic stack-up. March 20, 2019. by Kenneth Wyatt. Comments 27. Advertisement. Part 1 of this series described how digital signals propagate through PC boards [Refs. 1, 2, 5, 6]. In part 2, we look at specific board designs to achieve low EMI. The biggest issue I see in my clients’ board designs is poor layer stack-up.