Semiconductor Packaging News
A research team led by Hyeong-U Kim at KIMM has achieved a world-first: fabricating 4-inch heterostructure semiconductors using PECVD technology. This innovation enables low-power, high-performance AI semiconductors, enhancing efficiency & …
Semiconductor Packaging News
Advanced Packaging Driving New Collaboration Across Supply Chain. The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges.
Semiconductor Packaging News Index
Although House Speaker Johnson initially suggested ... CNBC. Nov 8, 2024. SUMMARY. Semiconductor firms ASML, AMD, Qualcomm reaffirm China commitment at CIIE trade fair. At Shanghai's CIIE trade fair, global semiconductor giants like ASML, AMD, and Qualcomm showcased advanced tech products, reaffirming their commitment ... South China Morning Post.
Semiconductor Packaging News
October 31, 2024. Back-end Semiconductor Equipment: Advanced Packaging to Propel the Market. The back-end semiconductor equipment market, essential for assembly and packaging, is set to grow in 2025, driven by AI investments and advanced packaging demands. Despite recent declines, revenue should rebound as AI and high-performance computing ...
Advanced Packaging Drives Test And Metrology Innovations
13 hours ago · Advanced Packaging Drives Test And Metrology Innovations. The semiconductor industry’s rapid shift towards advanced packaging is creating challenges in performance, thermal management, and signal integrity. Engineers now face diverse, complex packaging needs with high-density, high-frequency demands, requiring specialized testing methods and ...
Chip Industry Week In Review
2 days ago · Chip Industry Week In Review. Summary. Global semiconductor sales surged 23% in Q3 2024 to $166B, with strong growth in the Americas and China. SK hynix unveiled its AI-driven roadmap, while U.S. and international initiatives emphasize R&D and tech investments despite export control pressures. Semiconductor Engineering. Read the Full Article.
Funding Competition for Up to $1.6 Billion to Accelerate U.S ...
The Biden-Harris Administration announced a $1.6 billion funding opportunity under the CHIPS and Science Act to boost advanced semiconductor packaging in the U.S. This investment aims to enhance performance and competitiveness in microelectronics, addressing key …
The Evolution of Interconnects in Microelectronics Packaging
1 day ago · The Evolution of Interconnects in Microelectronics Packaging. Advances in semiconductor packaging, including hybrid bonding and heterogeneous integration, push critical interconnect innovations like direct copper & solder alternatives, boosting signal integrity. These breakthroughs fuel miniaturization & enhance performance in flexible electronics.
Wafer Shipments Remain Soft in 2024 Before Strong Expected …
Global silicon wafer shipments are projected to decline by 2% in 2024 but will rebound with a 10% growth in 2025. Rising demand for AI and advanced processing, along with new applications in packaging and memory, will drive growth through 2027. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
CHIPS Subsidy Boosts Advanced Packaging in U.S.
A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. The dedicated team at Semiconductor Packaging News has provided this summary for your ...